Using Silicon Photonics to support next-generation cloud computing, data center and high performance computing connectivity
Arlon Martin, Mellanox Technologies
Abstract:
As the fabrics of cloud computing, data centers and high performance computing scale to 100Gb/s, silicon photonics transceivers are fast becoming the technology platform of choice for reaches of up to 2km over single mode fiber. At 100Gb/s silicon photonics transceivers, using the popular QSFP28 form factor, offer lower power and cost than more traditional solutions.
This presentation focuses on the challenges and the innovations required to scale to much higher speed networks (400Gb/s and beyond) of the future.
Next generation transceivers need to scale to higher speed per lane, integrate more than four WDM channels, and leverage electronics-style, high-volume manufacturing.
Take a look at all the presentations secured to date and don't forget to book your place to take advantage of our early bird discount, saving €100. Delegate places are limited, so book today.
2 days, 6 themes, 30+ presentations
Sales of PICs are soaring, with their deployment helping to boost the capacity of networks and data centres. To aid this industry, we are strengthening the relationships between the makers and the users of these integrated circuits by launching PIC International, a global conference dedicated to this industry.
Attendees at the inaugural PIC International conference will hear industry-leading insiders delivering more than 30 presentations spanning six sectors.
PIC Internatio
nal provides comprehensive coverage of all aspects of this industry, from basic research to materials, equipment, packaging, and the incorporation of chips in data centres and optical networks. So whether you focus on system integration, developing and manufacturing components, financing this sector, or providing the materials and equipment needed to support this industry, PIC Internatio
nal is your must-attend co
nference for 2016.?
Presentations commited to date include:
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Aarhus University
ArtIC Photonics
Aurrion
BB Photonics
CEA-Leti
CISCO
Coriant
Finisar
Evans Analytical Group
EV Group
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Global Communication Semiconductors
HP
Huawei
IBM
Istituto Superiore Mario Boella
JePPIX
LioniX BV
Luceda Photonics
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McGill University
Mellanox Technologies
Microsoft
NTT Photonics Labs
PhoeniX Software
Politecnico di Milano
Ranovus
Smart Photonics
TeraXion
TU Eindhoven
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Six key themes
wher should the laser go?
Driving deployment of PICs in datacentres
Increasing the capability of optical networks
What's the role of the foundry?
Do we have the tools for designing, making, packaging and testing PICs?
A question of material: InP, silicon, or something else?
Tel: +44 (0)2476 718970
Website: www.picinternational.net
Email: info@picinternational.net
linkedIN: https://www.linkedin.com/grp/home?gid=8320227
Follow us on Twitter: https://twitter.com/pic_conference
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