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A Chinese company has developed the country's first semiconductor laser stealth wafer scribing machine after one year's work.

The equipment is jointly developed by China Great Wall Computer, a subsidiary of China Electronics Corporation, Zhengzhou Institute of Railway Information Technology and Henan General Intelligent Equipment Co.

The device is at the international leading level in key performance parameters, marking a substantial and significant breakthrough in China's semiconductor laser stealth wafer cutting technology, a milestone in further improving China's intelligent equipment manufacturing capabilities.

Laser cutting is a non-contact process that avoids damage to the surface of the crystalline silicon compared to traditional cutting methods.

Laser cutting is characterized by high processing accuracy and high processing efficiency, which can greatly improve the quality, efficiency and effectiveness of chip production and manufacturing.

By using special materials, special structure design and special motion platform, the semiconductor laser invisible wafer cutting machine can achieve high stability and high precision when the processing platform moves at high speed, and the motion speed can reach 500mm/s, which is much more efficient than foreign equipment.

On the optical side, based on the spectral characteristics of monocrystalline silicon, combined with the application level of industrial lasers, a laser with the appropriate wavelength, total power, pulse width and heavy frequency was used to achieve the final invisible cutting.

In terms of imaging, it uses cameras with different pixel sizes and different sensor chips with lenses of different efficacy to achieve product profile recognition and low, medium and high magnification level adjustment.

It is also equipped with a coaxial imaging system, which ensures real-time confirmation and optimization of the effect during cutting for optimal cutting results.